1. Who we are

HARMAN in numbers

GLOBALLY DIVERSE

• 30,000 Professionals worldwide
• 15,000 Engineers ~80% Software
• 30+ Countries: Americas, Europe
  and Asia
• 16+ Legendary brands
• 80% of luxury cars contain Harman Systems

INNOVATION LEADER

• 6,500+ Patents and patents pending
• 297 Awards in past 6 years
• 3 GRAMMY® Awards- AKG, JBL, LEXICON
• 2 Academy Awards

Our Business

Automotive

Infotainment, Multimedia, Connectivity, Car Audio Safety & Security Solutions

Digital Transformation

Cloud, Mobility and Analytics Solutions with Over-the-Air updates for Car, Mobile and Enterprises

Lifestyle

Premium Branded Audio Products and Sound Management Software for Home, Car and On-the-Go

Professional Solutions

Audio, Lighting, Video Switching and Enterprise Automation for Entertainment and Enterprises

Who we are:

2. What we do

Automotive Products

• Head Units
  • Infotainment
  • Instrument cluster
• Telemetics Control Unit
  • Connectivity
  • Navigation

Our Customers

3. Which simulation types are used

Simulation Types

SI simulation mothod

• SI simulations consider the complete transmission path from the transmitter’s IC Die to the receiver’s IC Die or segmented

• Applications : DRAMs, UFS, PCIe, USB, QSPI, FPD-Link, GMSL …
• Simulations SW:
  • Low Speed interfaces (QSPI, ETH, …)
    2.5D --> SIwave
  • High Speed IF (DRAMs, UFS, PCIe, USB3.x)
    2.5D / (3D) Solver - SIwave, ADS, CST (PCB studio) / HFSS, CST (MWOffice), ADS

AC Impedance analyses

• Scope:
  
  • Performed to determine Power Delivery Network (PDN) requirements of particularly critical components e.g., processors or memory modules
  • Evaluation of decoupling capacitors’ type, number and placement, as well as the design of the supply layers

• Applications: SoC, DRAMs, UFS, eMMC, etc.
• Simulations SW:

  2.5D solver

  SIwave, CST (PCB studio)

Voltage Drop & Current Density analyses

• Scope:
  
  • Are carried out in order to evaluate copper power planes geometry

• Applications: SoC, DRAMs, UFS, eMMC, etc.
• Simulations SW:

  2.5D solver

  SIwave, CST (PCB studio)

TDR analyses

• Scope:
  
  • Analyze and optimize the impedance discontinuities

• Applications:.GMSL, FPDLINK, DRAM, PCIe, APIX …
• Simulations SW:

  2.5D solver                             / (3D) Solver

  SIwave, ADS, CST (PCB studio) / HFSS, CST (MWOffice), ADS

2.5D Algorithms are efficient: fast and sufficiently accurate at the same time

Which simulation types are used:

• Scope:
  
  • Used to define layout design rules
  • Impedance discontinuities can be minimized or avoided
  • Optimize vias, connector pads, and wire crossings

• Applications: Simulations SW: High Speed signals
• Simulations SW :
  • 3D Solver à HFSS, ADS, CST (MWOffice)

4. When to use them

Need to do it

From a technical perspective:

• SI Simulation for IFs from 100MHz
• To validate the basic functionality before the first sample build
• In the case of measurement points that are far away, the signal behavior can be extrapolated down to the silicon in the transmitter/receiver using simulation.

Ensuring the HW design in a very early project phase, even without SW availability!

Without simulations the errors are often only discovered very late and to solve them an additional HW loop is necessary.

This means unplanned additional work and delay the project!

Time to do it

From a project planning perspective:

• Execution of SI/PI simulations as soon as the most important high-speed interfaces are routed

Boundary conditions:

• Development time varies greatly depending on the customer and the complexity of the product
• Usually, 3-4 HW iterations are planned. Duration per iteration 3-4 months
• Number of supporting colleagues varies
• Effort for SI/PI simulations increases because more high-speed interfaces are used