Steady-state and transient thermal simulations
Steady-state and transient thermal simulations to analyze temperature distribution in components and assemblies. We evaluate heat transfer via conduction, convection, and radiation under real operating conditions. Analyses may include thermal dissipation, heat sink design, active and passive cooling, and thermal performance of electronic components. Thermal effects can also be coupled with structural deformations and stress evaluations.
Thermal Simulation for Halogen Lamp
Improve thermal reliability of ECU automotive.
The product must to withstand in harsh thermal and mechanical conditions.
Solver: Ansy FLUENT in Ansys Icepak AEDT interface to define, solve and postprocess the results were
Accuracy: Ability to model and predict all heat transfer modes; conduction, convection and radiation.
Accurately predict temperature distribution in ECU electronic and mechanical components.
Able to improve thermal behaviour of ECU with fewer prototypes and physical tests.
Rollover analysis of a bus (RAR homologation)
Improving thermal characteristics of halogen car headlight.
A good thermal behavior of headlight improve optical properties of it.
Solver: Ansys FLUENT in Ansys Icepak AEDT interface to define, solve and postprocess the results were used.
Accuracy: Ability to model and predict all heat transfer modes; conduction, convection and radiation.
Accurately predict temperature distribution in headlamp components.
Able to improve thermal and consequently optical characteristics of headlamp with fewer prototypes and physical tests.
