Multiphysics simulations combining domains
Multiphysics simulations combining domains such as thermal–structural, fluid–structure, or electromagnetic–thermal. We analyze complex behaviors where interactions between physical phenomena affect product performance, thermal expansion under load, flow-induced vibrations, or Joule heating in electrical components. These models provide realistic predictions under real-world conditions and are essential for high-performance product development.
Inflatable Tent
To determine the stress and deformation states developed in the inflatable tent and its supporting structure (the exoskeleton) when subjected to three types of loading.
Solver: ANSYS Mechanical, Ansys CFD
Case 1: Loading with snow/sand at 50 kg/m². For this simulation, both the supporting exoskeleton structure and the elastic connection elements between the tent and the exoskeleton were considered. The ground footprint was defined by a length of L = 8 m and a width of l = 4.3 m, resulting in an area of 34.4 m².
Case 2: A load of 445 kg placed on the tent ridge, applied directly to the inflatable structure (without the exoskeleton).
Case 3: Loading due to a constant wind of 120 km/h. The pressure distribution on the tent surface was determined through a flow analysis (CFD) and transferred to the structural domain (inflatable tent and exoskeleton).
Cost savings form avoided physical tests.
The study identified the critical areas of the exoskeleton, and the structure was modified/improved to achieve an acceptable stress state, remaining below the allowable stress limits.
Reduced Product Development time and increase product life.
Electronics Reliability Prediction (Ansys Sherlock + Mechanical)
Check the reliability of the PCB assembly when subjected to thermal loads and vibration profiles.
Reduce workflow and improve predictability.
Reduce or eliminate prototype testing.
Solver: ANSYS Sherlock and ANSYS Workbench
Part Library: Sherlock part libraries contain over one million parts.
Physics coverage: capable of capturing key physics characteristic and phenomena by combining ANSYS Sherlock and ANSYS Workbench capabilities.
Cost savings form avoided physical tests (~50K/test).
Eliminate scheduling conflicts for prototype vehicle testing and meet program deadlines ahead of time.
Achieve high-confidence in 100% virtual validation with CAE models for future programs.
Induction machine transient electrothermal simulation
Analyze the transient thermal behavior of the induction machine during startup and operation.
Identify the time-dependent temperature distribution within the stator, rotor, and shaft.
Evaluate the impact of transient loads and operating cycles on the machine's thermal performance.
Ensure that temperature limits are not exceeded during transient operation to guarantee reliability and longevity.
Employing transient thermal simulation techniques to model the heat generation and dissipation over time.
Utilizing electromagnetic analysis (Ansys Maxwell) to calculate time-varying power losses within the machine components.
Importing time-dependent losses as heat sources into thermal analysis tool (Ansys Icepak).
Simulating the transient heat transfer through conduction, convection, and potentially radiation within the machine.
Deeper understanding of the machine's thermal response to dynamic operating conditions.
Identification of critical time points with maximum temperatures.
Optimization of the machine design and cooling strategies for transient loads.
Enhanced prediction of the machine's lifespan and reliability under realistic operating scenarios.
Thermal performance for electronic component (Maxwell-Icepak 2-way Coupling)
Analyze the thermal performance of the electronic component under realistic operating conditions.
Evaluate the effectiveness of the cooling solution (e.g., heat sink, airflow).
Identify potential hotspots and areas for thermal optimization.
Predict the component's temperature distribution for reliability assessment.
Utilizing Maxwell and Icepak for a coupled electro-thermal simulation.
Electromagnetic analysis in Maxwell to determine power losses (heat source).
Thermal analysis in Icepak using the power losses as input to simulate heat transfer.
Two-way coupling allows for iterative refinement, considering temperature-dependent material properties.
Accurate prediction of component temperatures and thermal behavior.
Improved design optimization for enhanced thermal management.
Reduced prototyping costs and time through virtual testing.
Increased product reliability and lifespan by mitigating thermal issues.
