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Using Ansys for Thermal Management of System-on-Chips (SoCs)

Written by Cristina Mihaela Dragan

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Continental Automotive Romania

Continental Automotive Romania is renowned for its innovative contributions to vehicle safety, efficiency, and connectivity. The team in Romania leverages advanced engineering capabilities and state-of-the-art facilities to deliver high-quality solutions that meet the evolving needs of the automotive market. Their expertise spans across various domains, including autonomous driving, powertrain technologies, and intelligent transportation systems, making them a vital part of Continental's global operations.

 

Task Description

Continental Automotive, a leading technology company, faced a critical challenge in optimizing the thermal management of their system-on-chips (SoCs). The objective was to highlight that for a Lidless vs. Lidded SoC it is crucial to consider the application boundary conditions (system approach), particularly focusing on liquid and air cooling methods. The complexity of managing heat transfer in these advanced semiconductor devices required a robust simulation and analysis approach to ensure optimal performance and longevity.

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Solution

Ansys provided a comprehensive suite of simulation technologies that enabled us to accurately model and evaluate different cooling scenarios for their SoCs.

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Benefits

  • Enhanced Thermal Management: This resulted in a reduction of the junction temperature up to 15% for liquid cooling for Lidded with heat-spreader design and an increase of the junction temperature up to 95% for Lidless and without heat-spreader design. ➜ It is not recommended to have a Lidless SoC design from cooling solution overall performance and costs.

 

  • Increased Efficiency: The optimized designs resulted in a 15% increase in overall system efficiency and a 25% reduction in cooling power consumption.

 

  • Scalability: This scalability enabled to streamline their design processes, reducing time-to-market for new products by 20%.