IC Packaging
Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, welding lines, air traps, voids, wire sweep, paddle shift, package warpage, etc.
Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.
Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.
Moldex3D IC Packaging include:
MCM
Moldex3D MCM diversifies the development of plastic molded product. Its explicit analysis capabilities enable users to evaluate insert molding, overmolding and multi-shot sequential molding process, helps accurately observe interaction behaviors and minimize part warpage.
Parallel Computing
All Moldex3D 3D solvers support multi-core and multi-CPU parallel computing to greatly shorten simulation time. Parallel computing can be done locally at your desktop or remotely on a computing cluster.
FEA Interface
Provides a series of FEA Interface modules integrated with industrial leading structural software, including ABAQUS, ANSYS, LS-DYNA, Marc, Nastran, and Radioss. Users can export Fiber and Stress analysis results to calculate further structural performance.
Stress
Provides stress distribution for parts and part inserts. Users can set boundary conditions, such as stress or force, to evaluate the structure quality of plastics and predict potential breakage or deformation.
Underfill
Simulates the compression molding process in which the polymer is squeezed into a preheated mold cavity. Moldex3D helps users check potential defects resulted from heat and pressure, decide appropriate materials, and optimize process conditions.
Compression Molding
Simulates the compression molding process in which the polymer is squeezed into a preheated mold cavity. Moldex3D helps users check potential defects resulted from heat and pressure, decide appropriate materials, and optimize process conditions.
