Cadence Interface (IC Packaging)
Why Cadence Interface?
Moldex3D supports import Cadence 3di file. Designer could save the full model, including epoxy region, chips, leadframe, wire and solar ball, etc, as the 3di file. User could import the file directly and the geometries could be modified.
What Can Moldex3D Do?
- Easier to import the complete packaging model for ECAD software
- Increases file-reading efficiency
- Significantly shortens the mesh preparation time for IC Packaging analysis
Applicable Moldex3D Package
Moldex3D eDesign Package (Encapsulation), Moldex3D Advanced Package