Ansys SIwave

Ansys SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs. The software is available in three product packages: SIwave-DC, SIwave-PI and SIwave. The products build upon each other, delivering maximum flexibility to equip PCB and package engineers with the analysis capabilities they require. The SIwave GUI has several Add-On solver technologies, such as the Sentinel-PSI solver and the Ansys Q3D Extractor solver, which enables streamlined analyses for 3-D Package Power Integrity and 3-D Quasi-static parasitic extraction of packages and PCBs.

Overview

Leading companies around the world trust Ansys SIwave to provide accurate, powerful and fast Power Integrity, Signal Integrity, and EMI analyses of complex electronic packages and PCBs. To accelerate model creation, SIwave imports ECAD files from well-known ECAD providers such as Altium, Autodesk, Cadence, Mentor Graphics and Zuken. Other formats such as GDSII, ODB++ and IPC2581 are supported as well, providing the ability to build up complete ECAD systems. This greatly improves the efficiency of analyzing modern electronic packages and PCBs to ensure proper product performance. To model real life devices, SIwave seamlessly transfers data to different physics solvers such as Ansys Icepak for thermal design and Ansys Mechanical for structural analysis within Ansys Workbench.

Features

ECAD Import, Translation, and MCAD Export

SIwave seamlessly integrates into existing EDA design flows by importing ECAD geometry, materials and components directly from third-party EDA layout tools. You can export the imported geometries and geometry cutouts to Ansys HFSS, Maxwell, Q3D Extractor and SpaceClaim (.sat) for use with MCAD editors.

SIwave-DC

The SIwave-DC product targets DC analysis of low-voltage, high-current PCBs and IC packages, enabling assessment of critical end-to-end voltage margins to ensure reliable power delivery. It allows you to perform pre- and post-layout “what-if” analyses for DC voltage drop, DC currents and DC power loss. This process ensures that power distribution networks (PDNs) can source the proper power to integrated circuits — checking that the PDN has the proper bump, ball and pin sizes, and proper copper weighting to minimize losses. The technology identifies areas of excess current, which can result in thermal hot spots, to reduce risk of field failure. You can quickly analyze path resistance (also known as partial resistance) between any components on a PCB or package to understand the PDN differences before choosing the best PDN topologies for sourcing power.

SIwave-PI

SIwave combines SIwave-DC and SIwave-PI functionality with the robust Ansys Nexxim time-domain circuit simulation engine. It enables fast Zo and cross-talk scanning with visual, color-coded feedback and HTML reports. SIwave employs specialized full-wave finite element algorithms to compute resonances, reflections, inter-trace coupling, simultaneous switching noise, power/ground bounce, DC voltage/current distributions, and near- and far-field radiation patterns on high-speed PCBs and complex IC packages. With SIwave, you can easily import ECAD geometry; extract GHz-accurate interconnect models for the IC, package and PCB; include transistor-level models of drivers and receivers; and run SSO analysis, impedance matching and power delivery system optimization. This solution includes common IBIS analyses, such as power-aware IBIS and IBIS-AMI, to provide virtual compliance to design engineers.

SIwave

SIwave combines SIwave-DC and SIwave-PI functionality with the robust Ansys Nexxim time-domain circuit simulation engine. It enables fast Zo and crosstalk scanning with visual, color-coded feedback and HTML reports. SIwave employs specialized full-wave finite element algorithms to compute resonances, reflections, intertrace coupling, simultaneous switching noise, power/ground bounce, DC voltage/current distributions, and near- and far-field radiation patterns on high-speed PCBs and complex IC packages. With SIwave, you can easily import ECAD geometry; extract GHz-accurate interconnect models for IC, package and PCB; include transistor-level models of drivers and receivers; and run SSO analysis, impedance matching and power delivery system optimization. This solution includes common IBIS analyses, such as power-aware IBIS and IBIS-AMI, to provide virtual compliance to design engineers.

Zo Scanner and Cross-talk Scanning

The Zo and crosstalk scanner provides very accurate field-solver characteristic impedances and coupling coefficients for traces within PCBs and packages. Easy-to-understand .html reports and visualizations make this a must have sign-off capability for all design engineers.

Near and Far-Field EMI

SIwave provides near- and far-field 3-D visualizations and 2-D compliance reports for packages and PCBs. Engineers can predict failures due to EMI/EMC and find the causes of existing issues, greatly reducing the amount of time it takes to pass emissions testing.

Conducted EMI

By adding an ANSYS Apache Chip Power Model (CPM) into SIwave, youcan predict the conducted emissions from an IC power delivery system into the package, PCB and system. This can include connectors, multiple PCBs, and the VRM.

Plane Resonances for PDN PI Analysis

You can predict the natural cavity resonances of a PCB or package using the plane resonance solver. This predicts resonances that can cause disruptions in the power delivery network and produce radiated emissions. The solution enables you to add IC die networks, SPICE and Touchstone models of all pertinent components within a PCB or package.

Automated Decoupling Optimization

When working in deep submicron technologies, designers are left with the task of reducing design costs to meet tight schedules on-budget. Optimization of today’s high-volume PCBs and packages is mostly based on different capacitor models, capacitor prices and numbers of capacitors, and it must be achieved without compromising the design’s signal- and power-integrity performance. SIwave-PI can find the optimized set of decoupling capacitor assignments that satisfy the impedance mask you specify at the minimum cost.

TDR and Flight Time Analysis

SIwave contains an easy-to-use setup wizard for studying time domain reflections (TDR) for packages and PCBs. The signal net analyzer quickly compares signal flight times and characteristic impedances for fast analysis. This is very useful when you need to understand electrical length vs. mechanical length in high-speed interfaces such as DDR4, PCIe 3.0, USB 3.0, etc.

IBIS and IBIS-AMI SerDes Analysis

SIwave includes circuit solutions for both parallel and SerDes busses. This includes simulation with the IBIS and IBIS-AMI driver/receiver models using the Ansys Nexxim or HSPICE circuit solver engine. Full schematic capture and parametric design for design of experiments (DoE) is included.

Network Data Exploration

Network data explorer enables quick and easy analysis of S-, Y- and Z-parameters, including passivity/causality checking/correction and mixed-mode analyses (differential pairs). You can view the data using a heat map or numerically in XY format. Additionally, numerous macro-model exports are available: HSPICE, PSPICE, Nexxim state space, Simplorer, Touchstone 1, etc. Users can view multiple Touchstone® files simultaneously. Cell filtering enables you to quickly analyze insertion and return loss. Parametric design variations from HFSS, SIwave and Planar EM can be plotted simultaneously.

Synopsys HSPICE Analysis

Ansys has partnered with Synopsys to enable HSPICE circuit simulations with ANSYS’ electromagnetic field solvers. This technology enables you to use either the Ansys Nexxim circuit solver or the HSPICE circuit solver within Electronics Desktop software. Desktop technology is included with SIwave, providing end-to-end solutions for electronic products.

Conducted Thermal Analysis with Icepak Solver

SIwave links to the Ansys software portfolio for multiphysics simulation of electronic components. One option is to export a power distribution map from SIwave into Ansys Icepak. This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables engineers and design teams to perform coupled EM–thermal–stress analysis for a complete understanding of the design.

Automation

SIwave enables end-to-end design flow automation using modern programming languages such as Python, VisualBasic, and Microsoft’s Visual Studio .NET programming tools. AC and DC analyses can be set up to run non-graphically in batch mode while you are working on other tasks, greatly improving your efficiency.

HPC

SIwave-DC, SIwave-PI and SIwave include high-performance computing (HPC) options that allow the solver to use multiple threads, cores and processors to solve large simulations. This parallelization enables full-packages-merged-to-board solutions for signal integrity, power integrity and electromagnetic interference, resulting in tremendous solver acceleration.

Chip-Package-System

Challenges of power delivery through the board, package and on-die power delivery network require you to perform signal integrity and power integrity analysis. Successful engineering teams are adopting simulation and analysis-driven product design flows for IC, package and PCB power delivery networks. The Ansys chip–package–system workflow provides chip-aware package and PCB analysis, as well as package and PCB-aware chip analysis. The workflow includes Chip Power Model (CPM), a compact SPICE-correlated model of the full-chip power delivery network. CPM comprises spatial and temporal switching current profiles and nonlinear on-chip devices to accurately represent chip behavior for package and PCB simulation. The workflow employs advanced meshing and multi-CPU solver technologies to rigorously solve Maxwell’s equations and generate accurate broadband models of the package and PCB. This approach enables you to identify and address causes of signal integrity and power integrity issues.

Virtual Compliance

SIwave enables you to determine if your DDR3/4 busses pass or fail the Jedec standard. This solution provides pass/fail criteria for key timing metrics, such as data setup and hold timings, derated analyses, bit-to-bit skew timing, overshoot, undershoot, etc. The programming environment enables customization of compliance reporting for almost any standard: DDR, USB, PCIe, MIPI, CISPR EMC, etc.

Brochures

  Ansys SIwave

  Ansys SIwave-DC